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[主題報導]6/16 前瞻技術·橋接未來-智慧電子產學媒合會 - 深耕智慧未來,搶得市場先機 2017/06/23

為了洞悉全球科技發展趨勢,因應高階醫材、智慧醫療、虛擬實境(AR/VR)、人工智慧(AI)、物聯網(IoT)及大數據分析(Big data)之新興應用,科技部智慧電子研發成果橋接計畫(NPIE Bridge) 106616()上午9時於新竹喜來登大飯店舉辦「前瞻技術·橋接未來-智慧電子產學媒合會」,以「創新研發、產學橋接」為主軸,吸引170人位產學研先進交流與會,不僅邀請到集邦科技劉炯朗董事長專題演講,更邀請到科技部許有進次長蒞臨指導,雖然當日下著大雨,仍不減各界與會熱情。

本次「前瞻技術·橋接未來-智慧電子產學媒合會」聚焦於「醫療」、「綠能」、「資通」與「車用」四大電子應用領域,邀請智慧電子及半導體領域之學界研究團隊於現場發表及展示研發成果,參與廠商領域則涵蓋健康醫療、生技、車用、資通訊、半導體、金融投顧及研究顧問等領域,約計100家廠商參與,共計完成76場一對一產學媒合洽談。

在這個電子技術蓬勃發展時代,期盼透過前瞻研究、跨界技術合作,探討全球產業發展趨勢及產學合作契機,共同開創前瞻技術,擘劃橋接智慧生活之願景。下半年科技部智慧電子研發成果橋接計畫將持續辦理產學媒合會,屆時期盼學界團隊積極報名,共創產學合作榮景。

陳總主持人於開幕致詞

許有進政務次長於開幕致詞

集邦科技劉炯朗董事長專題演講

當日與會盛況

 

To gain a deeper insight into the emerging applications of high-end medical devices, smart medical technologies, AR, VR, AI, IoT, and Big Data, the NPIE Bridge Program held an industry-academic matchmaking on advanced technologies, targeting at “research innovations” and “industry-academic Bridging.” 

This event took place on the 16th of June at the Sheraton Hotel, Hsinchu, for the purpose of attaining deeper knowledge on the global technology trends and applications, and breaking new ground in industry-academic collaboration. It focused on the applications of medical, green, 3C, and automotive electronics, featuring presentations of research results by academic research teams and one-on-one matchmaking between academic research teams and industry representatives. 

In this booming era of new electronics technology, it is hoped that cutting-edge technologies for smart living and can be created through advanced research and interdisciplinary cooperation. Smart living can be created.