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[產學] 6/16 前瞻技術‧橋接未來-智慧電子產學媒合會,歡迎蒞臨指導!
活動日期: 2017/06/16
活動網址: http://seminar.trendforce.com/Campaign/SmartEletricForum2017/TW/index/ 
說明:

為了洞悉全球科技發展趨勢,因應高階醫材、智慧醫療、虛擬實境(AR/VR)、人工智慧(AI)、物聯網(IoT)及大數據分析(Big data)之新興應用,科技部智慧電子研發成果橋接計畫(NPIE Bridge Program) 於106年6月16日(五)上午9時於新竹喜來登大飯店舉辦「前瞻技術·橋接未來-智慧電子產學媒合會」,以「創新研發、產學橋接」為主軸,洞察全球科技趨勢、聚焦智慧生活應用、引領產學共創新機,敬邀產業先進共襄盛舉。

「前瞻技術·橋接未來-智慧電子產學媒合會」將聚焦於「醫療」、「綠能」、「資通」與「車用」四大電子應用領域,邀請智慧電子及半導體領域之學界研究團隊於現場發表及展示研發成果,並安排一對一產學媒合洽談,歡迎於新興產品研發技術有產學合作需求之業者踴躍報名參與。值此新興電子技術蓬勃發展時代,透過前瞻研究、跨界技術合作,探討全球產業發展趨勢及產學合作契機,共同開創前瞻技術,擘劃橋接智慧生活之願景。

To gain a deeper insight into the emerging applications of high-end medical devices, smart medical technologies, AR, VR, AI, IoT, and Big Data, the NPIE Bridge Program will hold an industry-academic matchmaking on advanced technologies, targeting at “research innovations” and “industry-academic Bridging.”

This event will take place on the 16th of June at the Sheraton Hotel, Hsinchu, for the purpose of attaining deeper knowledge on the global technology trends and applications, and breaking new ground in industry-academic collaboration. It will focus on the applications of medical, green, 3C, and automotive electronics, featuring presentations of research results by academic research teams and one-on-one matchmaking between academic research teams and industry representatives.

In this booming era of new electronics technology, it is hoped that cutting-edge technologies for smart living and can be created through advanced research and interdisciplinary cooperation. All industry experts are welcome to join this event!